Used where the electronic assemblies are exposed to the harshest attacks. This can be dust, harmful gases, vibration or impacts and also aggressive liquids or just a lot of water. The potting completely encapsulates the assembly. The ability of the assembly to communicate naturally becomes very limited by this. Potting materials are available as hard or permanently flexible mixtures.
Two-component, low viscosity, thermally conductive silicone elastomer that cures rapidly at room temperature.